social recruitment-ag真人手机版

responsibilities:

1.responsible for the system application and reference design of automotive application,in related to body control, powerchain, domain control, etc.

2.development of software and algorithms of mcu, such as can/lin protocol stack, , domain control software, mcal, motor control,etc.

3.develop and test software for on-board communication and fault diagnosis based on system requirements;

4.provide technical support, and customer technical solution development support;

5.business trips and on-site customer support requirements.

requirements:

1.bachelor degree or above, master degree preferred, 5-10 years of working experience;

2.working experience in automotive electronics in embedded system development;

3.familiar with one or several of the following skills is preferred: can/lin communication protocol, body control system, embedded software and hardware development, bootloader, rtos, autosar, matlab, etc.

4.good team spirit.

responsibilities:

1. responsible for the development of the mcu driver software and unit test;

2. responsible for the development of the autosar/mcal software;

3. responsible for the development of the mcu functional safety fault diagnosis software;

4. responsible for the development of can/lin protocol stack;

5. responsible for the development of customer-specific application software.

requirements:

1. bachelor degree, master degree, major in computer/electronics/ communication/automation, with 5-10 years of working experience;

2. solid skills of embedded software/c, software programming, and testing specifications;

3. familiar with automotive software autosar/mcal, working experience in automotive electronics;

4. familiar with iso 26262 functional safety and software development certification process;

5. experience in rtos application or development, with a deep understanding of software engineering and development process;

6. good team spirit.

responsibilities:

1. responsible for the detailed design documents, rtl coding, rtl test, synthesis, and timing cleanup;

2. assist concept engineer in the definition of ic specification and architecture;

3. assist the verification engineer to complete the function simulation and gating simulation with the sdf information;

4. responsible for the release of chip fpga prototype version and assisting fpga test engineer in completing fpga test;

5. participate in the formulation of sample and mass production test schemes and assist in the convergence of relevant test problems.

requirements:

1. master degree or above, microelectronics major in electronic information, more than 3 years of relevant working experience;

2. solid skills of the digital ic design process, common digital circuit design, and optimization methods;

3. proficient in verilog or sv hdl language;

4. master standard eda tools of the digital front end, such as vcs, verdi, designcompile, formality, primetime, quartus, vivado, etc.

5. familiar with more than one script, such as makefile/shell/tcl/ python/perl, etc.

6. proactive, high learning ability;

7. good team spirit

experience in the following will be a plus;

8. knowledge of security areas functional safety.

responsibilities:

1.responsible for ip/subsystem/system-level verification of mcu/soc system;

2. develop and implement verification plan and verification strategy;

3. build verification environment with scripts; develop test cases; analyze function coverage and code coverage  complete gate-level simulation;

4. responsible for verification efficiency improvement by scripts;

5. research and development of new technologies, tools, and methodologies.

requirements:

1. bachelor degree or above, more than 3 years working experience (more than 1-year working experience for graduate students), major in microelectronics/computer/communication/telecommunications and other related majors;

2. proficient in system verilog and uvm, familiar with assertions and functional coverage writing;

3. proficient in c and scripts (perl/shell/makefile/python);

4. familiar with various interface peripherals (i2c/spi/uart/ethernet/can/lin/...);

5. familiar with amba bus protocol (axi / ahb / apb) and be proficient in the use of vip;

6. familiar with the pre and post-simulation verification process;

7. experience in 32-bit mcu or soc verification is preferred;

8. familiar with fault injection simulation and verification is preferred;

9. knowledge of iso 26262 development verification process is preferred;

10. proactive, good team spirit.

responsibilities:

1. participate in product definition and product feasibility assessment； complete the specification of the circuit under the guidance and ensure accuracy;

2. complete the circuit design within the schedule and efficiently, guide the layout engineer, and assist product design implementation;

3. responsible for documenting circuit/layout/test specifications, patent application, etc.

4. assist product engineers to complete debugging, testing and be responsible for circuit debug, circuit optimization, or revision work.

requirements:

1. major in microelectronics and integrated circuit, master's degree with at least 2 years experience with circuit design and successful production tape-out;

2. familiar with semiconductor device physics, cmos integrated circuit process, layout design principles, and skills;

3. professional in skills to use eda tools and layout tools;

4. strong sense of responsibility, cooperation ability, and good communication skills;

5. good english communication and reading skills;

6. priority will be concerned with the following working experience;

7. adc and dac design experience: sar adc, delta-sigma adc, pipeline adc, different types of dac, etc.

responsibilities:

1.participate in product definition and product feasibility assessment；independently define and compose specification/datasheet of analog circuits with accuracy;

2.deeply understand the influence of ic process and parameters on circuit design, and participate in process analysis/evaluation;

3.complete the circuit design within schedule and efficiently, guide the layout engineer, and assist product design implementation;

4.responsible for documenting circuit/layout/test specifications, technical training, patent application, acting as a mentor, etc.

requirements:

1.major in microelectronics and integrated circuit, master's degree with at least 5 years experience or doctor's degree with at least 2 years experience with chip design and successful production tape-out;

2.familiar with semiconductor device physics, cmos integrated circuit process, layout design principles and skills, packaging and testing;

3.professional in skills to use eda tools and layout tools;

4.strong sense of responsibility, cooperation ability and good communication skills;

5.good english communication and reading skills;

6.priority will be concerned with the following working experience;

      a.high performance adc and dac design experience: sar adc, delta sigma adc, pipeline adc, different types of dac, etc.

      b.high precision reference source, low noise, high performance opa / afe, high performance pmic;

      c.low power consumption, high performance pll, osc, different types of io.

responsibilities:

1. familiar with the layout design, verification, and delivery workflow;

2. independently implement analog circuit layout design and digital-analog hybrid circuit integration;

3. have a deep understanding of the ic manufacturing process and be able to participate in process analysis;

4. independently complete circuit floor planning and deeply understand the principles and layout implementation schemes of matching, shielding protection, noise isolation, parasitic optimization, latch-up, esd, antenna effect, etc.

requirements:

1. bachelor degree or above in microelectronics and integrated circuit, with at least 3 years of analog or digital-analog hybrid integrated circuit layout design experience;

2. familiar with semiconductor device physics and cmos integrated circuit manufacturing process, and have a precise understanding of the basic principles of simulation;

3. master layout eda tools, layout design, and physical verification;

4. conscientious, good team spirit, and good organizational and communication skills;

5. team leader preferred.

responsibilities:

1. define, assess and own detailed product requirements for industrial & automotive microcontrollers based on analyzing application and stakeholder requirements. translate technical targets  into product requirements;

2. engage with product marketing and system architect to prioritize the features and feed them into product roadmaps;

3. interact with lead customers and system manufacturers for stakeholder requirements capturing;

4. conduct technical synchronization with customers in the product definition phase;

5. perform peer-review of product architecture, safety concept, hardware/software requirement;

6. support r&d functions regarding clarification of technical details, including features, performance, and quality;

7. support validation of customer prototypes/systems, additionally in evaluation boards, to analyze issues quickly and accelerate time-to-market;

8. provide reports regarding product performance/benefits and limitations/challenges to application and product marketing;

9. provide product documentation and training to ae/fae.

requirements:

1. master degree in electrical engineering, physics, computer science or similar;

2. 5 years of professional experience related to ic product definition or application engineering in the semiconductor industry;

3. expert knowledge of analog, digital and mixed-signal devices;

4. programming skills in c;

5. preferably experience with motor and power control;

6. fluent english skills.

responsibilities:

1. develop automotive mcu family product;

2. responsible for automotive mcu architecture definition and safety mechanism definition at different levels as iso26262 required;

3. perform review/walk-through/inspection on every development milestone (design, verification, dft, packaging, and test) to ensure function and safety commitment;

4. responsible for functional safety definition, safety requirement analysis, fault injection, and failure model analysis.

requirements:

1. master's degree, more than 10 years of chip design experience;

2. familiar with mcu cores for industrial/automotive use;

3. know-how on security use for automotive, familiar evita standards. solid skills to define hsm architecture;

4. familiar with safety requirements on process of design, verification, software, dft, backend, testing;

6. at least 8 years working experience in chip development, experience in automotive development will be a plus;

7. experience in automotive chip architecture design;

8.iso 26262 certification.

responsibilities:

1. define the detailed safety concept/ architecture based on specified safety requirements;

2. perform safety analysis fmeda, fta, 

hazop, dfa, with support of system architect and r&d team;

3. propose technical solutions for identified issues based on own experience or the latest methodologies in related projects;

4. monitor the progress of function safety activities  and trigger design updates during the product lifecycle;

5. defend function safety architecture and analysis in external and internal audits and assessments;

6. staying connected to the standardization administration to get insights into relevant projects and continuously make updates;

7. application and review of patents.

requirements:

1. master or ph.d. in electrical engineering, telematics, information technology, physics or comparable;

2. 3 years of professional experience in semiconductor product development, ideally in industry and automotive, including functional safety (e.g., iso 26262, iec 61508, and other relevant safety standards);

3. iso26262 certification;

 4. solid skills in function safety analysis methods fmeda, fta,  hazop, dfa;

 5. knowledge of analog or digital ic design;

 6. fluent communication in english.

岗位职责：

1、负责新产品市场分析及新产品规格制定，对产品竞争力负责； 

2、负责新产品的立项，负责产品的全生命周期管理； 

3、利用内外资源，驱动新产品的市场推广和落地； 

4、参与过产品立项、设计、研发、推广应用及维护改进的整个过程；熟悉目前主要的各类客户端产品特点。 

任职要求： 

1、电子/计算机/自动化相关专业本科以上学历，5年以上相关工作经验；

2、有mcu软硬件开发经验，了解芯片开发流程，能够独立分析客户需求并给出ag真人手机版的解决方案，有mcu产品市场工作经验者优先；

3、熟悉市场调研方法和工作流程，擅长与业务/ag真人官方网的技术支持部门深度沟通、挖掘潜在需求，熟悉业务分析方法，擅长需找产品机会点；

4、具备电机驱动、安全技术、电源管理、无线技术等相关经验者优先。

岗位职责：

1、依据产品线的战略述求，制定符合战略要求的无线产品路线图，并推动落地实施；

2、根据产品线路图，进行新产品charter立项开发；

3、协调各部门资源和支持，对于芯片和方案的整体时间以及风险进行管控，确保开发顺利开展，确保产品业务目标；

4、组织制定市场策略、市场计划、上市发布、品牌营销策略和渠道政策等工作，主导α客户筛选，推动α客户验证；

5、主导产品营销工具包的制作、主导新产品的上市培训，对产品全生命周期进行管理维护。

任职要求： 

1、电子相关专业本科或以上学历，5年以上工作经验，2年以上芯片原厂市场经验，有ble、wi-fi、mcu或iot市场经验者优先；

2、有低功耗蓝牙，wi-fi，或zigbee等开发应用经验，有芯片开发经验优先，了解芯片开发流程；

3、对于物联网市场及技术发展趋势有良好的嗅觉，对行业内主要芯片提供商有深入的了解，有能力独立设计演进产品形态；

4、熟悉市场调研方法和工作流程，擅长与业务/ag真人官方网的技术支持部门深度沟通、挖掘潜在需求，熟悉业务分析方法，擅长需找产品机会点。

岗位职责：

1、参与芯片模拟总体方案设计、负责模拟模块规格制定、架构设计和电路实现；

2、负责模拟电路设计和仿真，编写电路设计文档；

3、负责指导版图设计，确保模拟性能的实现；

4、参与模拟模块样片测试与回归分析、量产支持，确保样片和量产测试顺利开展。

任职要求：

1、硕士及以上学历，微电子、电子工程相关专业，3年及以上相关工作经验；

2、具有模拟电路设计、半导体工艺、芯片esd/latch up可靠性方面扎实的理论基础；

3、具备mix-signals电路bandgap、osc、xtal、ldo、gpio、adc、pll、dcdc等相关设计能力；

4、具备一定的模拟版图设计经验，同时能够指导版图工程师进行版图设计；

5、积极主动，有较强的学习能力，良好的团队沟通能力以及团队协作能力；

6、有adc成功ip项目量产流片经验优先。

岗位职责：

1、负责数字ic电路模块的规格定义，设计文档编写，保证数字模块实现的准确性；

2、负责rtl编码、自测、综合和时序收敛，保证设计达成功能、速度、面积、功耗等目标；

3、负责fpga原型测试平台的搭建并协助调试，保证fpga测试工程师完成测试工作；

4、参与样片和量产测试方案的制定并协助调试，确保样片和量产测试顺利开展。

任职要求：

1、硕士及以上学历，微电子、电子信息等相关专业，3年以上相关工作经验；

2、精通verilog或sv语言，熟悉xilinx或altera fpag开发软件，了解fpga设计流程、熟悉常用的一门以上脚本语言，如makefile/shell/tcl/python等；

3、熟悉数字ic设计流程和数字前端eda工具，熟悉至少一种常用的通信协议，如i2c/uart/spi/usb/i2s等，熟悉amba ahb/apb等总线协议；

4、积极主动，有较强的学习能力，良好的团队沟通能力以及团队协作能力；

5、有arm cortex-mx系列mcu开发经验者优先。

岗位职责：

1、主导模块级和系统级验证，保证芯片功能验证的完备性；

2、负责验证需求分解，验证计划的制定，保证验证结果的完备性；

3、负责验证平台的开发与维护，使用system verilog、uvm等语言，保证验证平台的高效性与可继承性；

4、负责验证用例的开发与调试，保证芯片功能的正确性；

5、参与解决在芯片在样片测试过程中遇到的问题，确保无致命缺陷遗漏到客户。

任职要求：

1、硕士及以上学历，微电子、电子信息等相关专业，2年以上相关工作经验；

2、熟悉verilog和system verilog语言以及uvm验证方法学；

3、熟悉通信接口协议，如spi，i2c，uart，usb等；

4、积极主动，有较强的学习能力，良好的团队沟通能力以及团队协作能力；

5、有32位mcu或soc验证经验者优先。

岗位职责：

1、负责时序约束开发、设计综合、布局规划、电源网络规划、时钟树生成、布线实现、时序分析、ir风险和物理验证工作，保证综合及布局布线后的ppa指标最优；

2、主导后端实现流程过程自动化的开发与维护；主导后端实现的设计方法学构建与更新；

3、参与前端时钟树和复位树的设计，参与特殊时序约束的开发与验证，参与后端封装设计和esd规划，保证芯片封装设计的可行性并满足可靠性要求；参与公司不同工艺sign-off标准制定，确保后端时序和ir满足要求参与前端时钟树和复位树的设计，参与时钟树生成设计和规划，参与特殊时序约束开发，参与sign-off 标准制定，确保后端实现时序满足要求。

任职要求：

1、硕士及以上学历，微电子、电子信息等相关专业，3年以上相关工作经验；

2、熟悉hdl语言，了解rtl编码规则和设计规,掌握后端实现流程与规范；

3、精通sdc和tcl， 熟悉make 和 shell编程并能够开发自动流程；

4、精通dc/pt/pr工具（icc/innovas),熟练使用形式验证工具；熟悉常用ir分析工具和pv验证工具；

5、熟悉常用工艺的signoff要求和标准，掌握后端设计和分析方法学，了解封装相关工艺和要求；

6、积极主动，具有较强的学习能力，良好的团队沟通能力以及团队协作能力。

岗位职责：

1、负责模拟电路的版图设计，包括模块或者整个芯片的布局规划，物理布局，布线和验证等；

2、负责完成版图的物理验证工作；

3、负责配合模拟电路设计人员进行电路后仿、优化版图；

4、负责tape out流程及jdv检查；

5、负责相关版图设计文档的撰写，保证项目文档的完整性。

任职要求：

1、本科及以上学历，微电子、电子信息等相关专业，5年以上相关工作经验；

2、熟练使用相关的eda工具；

3、具备做whole chip规划的能力；

4、积极主动，具有较强的学习能力，良好的团队沟通能力以及团队协作能力。

岗位职责：

1、负责ip和soc dft架构规划，负责mbist,atpg, boundary scan, jtag和ip test的实现及pattern生成与仿真调试，保证dft在前后端实现的完整性和正确性；

2、主导ip/soc先进的dft设计架构和方法学，保证公司内dft设计流程的先进性；

3、参与前端时钟树和复位树的设计，参与测试模式的sdc开发，与sta工程师合作确保测试模式的时序正确性并协助解决相关问题。

任职要求：

1、硕士及以上学历，微电子、电子信息等相关专业，3年以上相关工作经验；

2、熟悉verilog，熟悉dft理论和方法，熟悉综合、sta等asic实现流程；

3、熟练使用dft eda工具使用；

4、能够熟练使用脚本语言进行常用工具开发工作；

5、熟悉ieee1149、1/1149、6/1500标准, 有boundary scan经验者优先；

6、积极主动，具有较强的学习能力，良好的团队沟通能力以及团队协作能力。

岗位职责：

1、负责智能电子产品的demo整机设计及开发、夹具设计，样机装机，芯片应用结构参考方案开发；

2、负责新产品结构设计和开发、开模分析以及生产工艺分析，能够控制住成本，并确保产品的可靠性、生产稳定性；

3、负责产品安规、散热、屏蔽等结构的设计与研究，配合硬件工程师以提升产品性能；

4、负责产品新工艺、新材料、新结构等方面的前沿性试验与研究。

任职要求：

1、机械，材料，力学等相关专业本科或以上学历；

2、8年以上消费类电子结构设计及开发经验，其中3年以上手机或平板或笔电结构设计经验；

3、有电子产品堆叠设计经验，能配合硬件工程师工作；

4、对电子产品组装工艺熟悉，动手能力强，熟悉电子产品的常见表面处理工艺；

5、能熟悉运用公差分析、dfema的结构设计工具；

6、具备良好的失效分析能力，能够在堆叠阶段识别失效风险，能够结合失效样品的分析和仿真分析确定产品的失效原因，并给出改善对策；

7、对常用塑料、五金材料有深入了解，具备塑胶模具及冲压模具相关知识；

8、具备良好的责任心，沟通能力，团队协作能力和动手能力，学习能力突出，喜欢挑战和创新。

岗位职责：

1、负责智能电子产品的结构仿真交付工作，在产品立项阶段识别潜在的失效风险并给出ag真人手机版的解决方案；

2、负责可靠性测试失效相关问题仿真，在产品开发阶段识别失效原因和提供对策；

3、负责仿真优化和仿真标准化，进行仿真和设计及实验拟合的闭环分析和改进；

4、负责新产品结构开发、测试夹具设计、模具跟进；

5、负责产品安规、散热、屏蔽等结构的设计与研究，配合硬件工程师以提升产品性能；

6、负责产品新工艺、新材料、新结构等方面的前沿性试验与研究。

任职要求：

1、机械，材料，力学等相关专业本科或以上学历；

2、2年以上结构仿真经验，3年以上通用结构设计经验；

3、具备扎实的结构力学、材料力学和有限元理论基础；

4、掌握有限元仿真的流程和应用，熟练使用hyperworks、abaqus和ansys等结构仿真软件中的2种或以上，熟悉仿真算法优化；

5、精通静力分析、跌落冲击等结构仿真手法、对结构件的刚度、强度、应力、应变等力学性能进行准确的评估；

6、具备良好的失效分析能力，能够在堆叠阶段识别失效风险，能够结合失效样品的分析和仿真分析确定产品的失效原因，并给出改善对策；

7、对常用塑料、五金材料有深入了解，具备塑胶模具及冲压模具相关知识；

8、具备良好的责任心，沟通能力，团队协作能力和动手能力，学习能力突出，喜欢挑战和创新。